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The 2017 International Printing Electronics and Intelligent Packaging Industry Development Summit Forum was successfully held in Changzhou.
Publish Time
2018/01/05
On October 24, 2017, the 2017 International Summit Forum on the Development of Printed Electronics and Intelligent Packaging Industry was successfully held in Changzhou High-tech Zone. The conference was hosted by Changzhou Institute of Printed Electronics, National Technology Innovation Alliance of Printed Electronics Industry, and the Joint Body of Printed Electronics and Intelligent Packaging Industry, and undertaken by Jiangsu Enfu Sai Flexible Electronics Co., Ltd. and Ruitong Science and Technology Media. More than 300 representatives from domestic and foreign printed electronics and intelligent packaging related industry institutions, preparatory units of the Joint Body of Printed Electronics and Intelligent Packaging Industry, end users of intelligent packaging and printing industry, industry-academia-research and investment institutions attended the summit.
This summit discussed the application of global printed electronics technology in the intelligent packaging industry, market status, development trends, opportunities and challenges, and prepared the establishment of the world's first "Joint Body of Printed Electronics and Intelligent Packaging Industry" during the summit, and issued the Joint Body certified membership certificates, working together with the members of the Joint Body to promote the development of China's intelligent packaging industry.
In the morning, Zhang Xiacang, Dean of Changzhou Institute of Printed Electronics, National Thousand Talents Program expert, inventor of thin-film printed batteries, and Chairman of Jiangsu Enfu Sai Flexible Electronics Co., Ltd., delivered a keynote speech entitled "Current Status of China's Printed Electronics Industry Development and Progress of Joint Body Preparation", and presided over the establishment ceremony of the Joint Body; Dr. He Xiaoxi, Senior Technical Analyst of ID TechEx, introduced "Review and Future Trends of Intelligent Packaging"; Dr. Klaus Hecker, Managing Director of OE-A, introduced "Roadmap for Organic and Printed Electronics: Opportunities and Challenges for Intelligent Packaging Applications".
In the afternoon session on "Application of Electronic Anti-counterfeiting Technology and Special Materials in Intelligent Packaging", Dr. Chen Guangxue, Chief Technical Expert and Dean of Yutong Research Institute of Yutong Technology, introduced "Application of Digital and Visualization Technology in Intelligent Packaging"; Professor Cao Congjun, Executive Vice Dean of the School of Printing Packaging and Digital Media, Xi'an University of Technology, and Director of Shaanxi Provincial Engineering Technology Research Center for Printing Packaging, introduced "Development and Industrial Application of Intelligent Label Technology"; Professor Gyoujin Cho of Sunchon National University, Korea, introduced "Bridging R2R gravure printed FPCB and Si-chip to demonstrate a temperature sensor integrated NFC tag for food packaging"; Dr. Ye Changqing, General Manager of Suzhou Zhongke Nafu Materials Technology Co., Ltd., introduced "Cai Zhibao Intelligent Label, Relaying the Last Mile of Cold Chain"; Dr. Wang Jun, Professor of Packaging Engineering Department, Jiangnan University, introduced "Intelligent Packaging Enhances Consumer Experience---From Cases to Practice"; Zhang Xingye, Associate Researcher of the Institute of Chemistry, Chinese Academy of Sciences, introduced "Nano-conductive Ink and Its Application in Intelligent Packaging".
In the afternoon session on "Application of RFID and Internet of Things Technology in Intelligent Packaging", hosted by Dr. Zhang Jie, Vice Dean of Changzhou Institute of Printed Electronics, Zhang Kaixing, Chairman of Shenzhen Kaigely Intelligent Technology Co., Ltd., introduced "Packaging with Core, Intelligent Progress---Application of RFID Technology in Intelligent Packaging"; Dr. Toshihide KAMATA, Director of Flexible Electronics Research Center, AIST, introduced "Advanced print manufacturing techniques for intelligent packaging"; Professor Guo Xiaojun of Shanghai Jiao Tong University introduced "Low-power Flexible Hybrid Integrated Electronic Systems: Traceability, Anti-counterfeiting and Sensing"; Tommy Hoglund of RISE Acreo introduced "How to integrate printed hybrid electronics in packaging and other smart label solutions"; Dr. Jiang Hua, Vice President of Jingjia Group, introduced "Application of Internet of Things Technology in Intelligent Packaging"; Nakabayashi Takamitsu, Minister of Planning and Development Department, TOPPAN Security Anti-counterfeiting Business Promotion Department, introduced "NFC Application Solutions and Case Practices in Intelligent Packaging".
The summit conducted in-depth communication and discussion on the development and prospects of the intelligent packaging industry, bringing together upstream and downstream enterprises such as well-known domestic intelligent packaging suppliers, solution providers, and component suppliers, and put forward many constructive opinions and suggestions for the development of China's intelligent packaging industry. At the same time, it formed the "Joint Body of Printed Electronics and Intelligent Packaging Industry" as the core, integrating the intelligent packaging industry chain, and opening up the industrial closed loop, which is of great significance to promoting the development of the intelligent packaging industry, and is a milestone moment for the development of China's intelligent packaging industry.
The 2017 International Summit Forum on the Development of Printed Electronics and Intelligent Packaging Industry came to a successful conclusion with a closing address by Mr. Wang Zhan, Vice President of Enfu Sai Printed Electronics, and the attendees gave a warm applause. The summit forum concluded successfully.
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