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Grand Launch of Printed Electronics Week in October: In-depth Analysis of Three Top Events and the Printed Electronics Industry Landscape
Publish Time
2017/07/31
Three top-tier events—the 2017 International Summit Forum on Printed Electronics and Intelligent Packaging Industry Development, the 7th National Symposium on Flexible and Printed Electronics (FPE China 2017), and the 8th OE-A Asian Working Group Meeting—will be held successively starting October 23, 2017. A week-long "Printed Electronics" event bringing together industry elites will follow. Printed electronics professionals from various industries and around the world will gather to witness this industry event.
"Printed electronics" and "flexible electronics" have attracted widespread attention from the domestic scientific and industrial communities, with more and more research teams investing in R&D in these fields. In 2016, the country began implementing a major research plan on "printed displays." Printing, as a new type of electronic manufacturing technology, has become an important direction for innovation and transformation in China's manufacturing industry. These three major printed electronics events will focus on printed electronics, while also discussing and sharing information on related derivative industries, upstream and downstream industries, such as intelligent packaging and the Internet of Things.
The 2017 International Summit Forum on Printed Electronics and Intelligent Packaging Industry Development is hosted by Changzhou Institute of Printed Electronics, Printed Electronics and Intelligent Packaging Industry Consortium (PEIPC), and National Printed Electronics Industry Technology Innovation Alliance (IAPE), and undertaken by Enfu Sai Printed Electronics and Ruitong Science and Technology Media. It will be grandly held at the Changzhou Dinosaur Park VJing Hotel on October 24, 2017.
This summit will focus on discussions surrounding the global application of printed electronics technology in the intelligent packaging industry, including market conditions, development trends, opportunities, and challenges, to jointly promote the development of China's intelligent packaging industry.
More than 300 guests from domestic and foreign printed electronics and intelligent packaging related industry organizations, domestic and foreign scholars, preparatory units of the Printed Electronics and Intelligent Packaging Industry Consortium, members of the National Printed Electronics Industry Technology Innovation Alliance, representatives of intelligent packaging and printing industry end-users, industry-academia-research and investment institutions, and other related industry professionals will attend the summit to discuss the development of the intelligent packaging industry and explore the next trillion-dollar intelligent packaging application market.
Contact for registration:
Ms. Hao Sixin Phone: 0519-69887708 Email: sixin.hao@czipei.com
The 8th OE-A Asian Working Group Meeting, the Asian branch of the OE-A summit, is hosted by the Changzhou Institute of Printed Electronics and will be held in the Changzhou Institute of Printed Electronics conference hall on October 23, 2017.
The OE-A Asian aims to connect related companies, research institutions, and downstream manufacturers in the printed electronics industry chain, establishing mutually beneficial cooperative relationships, promoting the integration of the industry chain, coordinating relationships between various links in the industry chain, and facilitating valuable collaboration and information exchange.
Contact: Feng Zhijun Phone: 0519-69887703 Email: zhijun.feng@czipei.com
From October 25th to 27th, 2017, the 7th National Symposium on Flexible and Printed Electronics (FPE China 2017), hosted by the Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Printed Electronics Technology Research Center (PERC), National Printed Electronics Industry Innovation Alliance, and Suzhou Nano-technology Development Co., Ltd., will be held in Hall A1 of the Suzhou International Expo Center.
This conference will focus on 12 topics, including flexible electronics and printed electronics manufacturing processes and equipment, printed sensor technology and its applications, printed flexible, stretchable, and wearable electronics technology, and the printing preparation technology and application of PCBs and RFID antennas. The conference will invite internationally renowned experts to introduce the latest developments in this field and provide a platform for communication among domestic experts, scholars, and researchers engaged in the research and development of flexible printed electronics.
This symposium will be held concurrently with the China (Suzhou) International Nanotechnology Industry Development Forum and Exhibition (CHINANO 2017 Conference & Expo) at the same location. During the conference, there will also be exhibitions of nanotechnology, MEMS technology, and flexible and printed electronics technology, inviting domestic and foreign companies in related fields to participate. This will be a grand event of multidisciplinary and multi-field cross-integration of micro-nano technology and flexible and printed electronics technology. We sincerely invite a wide range of scientific and technological personnel and industry representatives to participate.
Nano Expo Center: Wan Chengdong Mobile: 13584824068 Email: wancd@sipac.gov.cn
These three consecutive printed electronics events will allow participants to learn about the latest achievements in the development of the printed electronics industry, witness the discoveries of industry pioneers in their explorations, share and learn from each other's experiences in their respective fields, and discover industry opportunities. We look forward to the participation of industry elites from all walks of life to jointly create a bright future for printed electronics.
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